Cooling,, Thermal Paste Compound IC Diamond 24 Carat

Pricing:
IC Diamond 24 carat 1100
IC Diamond 7 carat 600

Overview


IC Diamond 24 Carat Thermal Compound (~5g)

Product Description & Info


Specifications:

Size: 4.8 gram tube
Thermal Conductivity: 4.5 W/m-K (data acquired with an ASTM D - 5470 thermal interface test instrument)
Thermal Resistance: 0.25°C-cm2/W@ 100 µ BLT
Electrically Conductive: No

Description:

Each tube of IC Diamond Thermal grease contains 24 carats of micronized diamond with diamond particle loadings @ 92% by weight, 94% after 10 minute dry-out prior to heat sink installation. Material loading above 90% is recommended as the best combination of rheological and thermal properties to minimize interface pump out due to thermal cycling. Superior bulk conductivity. Excellent thermal impedance. Tight particle distributions. < 40 µ maximum particle diameter. Silicone free. Lower viscosity. Greater stability. Non capacitive or electrically conductive.



Application Instructions:

According to the manufacturer:

Due to the high amount of diamond powder (94%) in IC Diamond Compound, the material is very thick. The plunger on the syringe should not be forced which would result in its breaking. Squeeze slowly using constant, even pressue - it will take about 3-4 seconds to squeeze out the proper amount. Warming the Thermal compound syringe in a cup of hot water for several minutes will enhance application.
Clean the CPU to ensure that it is clean of any grease or particulate matter. Squeeze a pea-sized amount of IC Diamond in the center of the CPU and apply the heatsink. Once the heatsink is mounted, the compound will spread out and cover the entire CPU and settle into a uniform thickness in about 2 hours.
Savings Note: Covering the entire CPU is a waste of compound as any excess is squeezed out - the final bond line is only .001 or .002 inches thick. Single line and other application methods do not provide uniform coverage and will require re-application for the best results.

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